Chip socket assembly and chip file assembly for semiconductor chips

ABSTRACT

A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

This is a continuation of U.S. patent application Ser. No. 09/468,247,filed Dec. 20, 1999, which is now U.S. Pat. No. 6,352,435, which isitself a divisional application of U.S. patent application Ser. No.08/887,567 filed Jul. 3, 1997, now U.S. Pat. No. 6,007,357 issued Dec.28, 1999, which is a continuation of U.S. patent application Ser. No.08/452,120 filed May 26, 1995 now abandoned.

FIELD OF THE INVENTION

The present invention relates generally to the field of chip connectors.More particularly, the present invention relates to the field of chipconnectors for mounting chips on circuit boards.

BACKGROUND OF THE INVENTION

A semiconductor device is typically packaged as a chip and mounted on acircuit board to mechanically and electrically connect the semiconductordevice to the circuit board. This allows semiconductor device to beelectrically connected to various other electrical devices within adigital data processing system.

One known package type is a surface vertical package (“SVP”), whichprovides for the edge-mounting of chips to circuit boards. Thesemiconductor device is packaged in a relatively flat package such thatthe leads that provide for electrical connections to the semiconductordevice are positioned on one edge of the chip. Each lead of the SVP chipmay be soldered to a respective solder pad on a circuit board tomechanically and electrically connect the semiconductor device to thecircuit board. The leads of the SVP chip are bent substantiallyperpendicular relative to the SVP package so that the SVP chip may beplaced upright over the circuit board in soldering each lead to itsrespective solder pad. The SVP chip may have at its bottom edgesupporting pins, for example, to help the SVP chip stand upright insoldering the SVP chip to the circuit board.

In soldering the SVP chip to the circuit board the SVP chip maynevertheless fall over, for example by the mechanical movement of thecircuit board through a solder oven, and thus have to be resoldered tothe circuit board. Even after soldering the SVP chip to the circuitboard, the electrical connection between the SVP chip and the circuitboard must be tested to ensure that each lead of the SVP chip has beenproperly aligned with and soldered to its respective solder pad on thecircuit board. If the SVP chip has not been suitably soldered to thecircuit board, the SVP chip must be resoldered.

Furthermore, the solder connection between the SVP chip and the circuitboard may deteriorate during the life of the circuit board, for exampleby being subjected to various mechanical stresses. Typical users may nothave the equipment or know-how to resolder a SVP chip to the circuitboard and subsequently test the resulting electrical connection. Thus, auser could be inconvenienced and subjected to the cost of having toreplace the circuit board or having someone else resolder a SVP chip tothe circuit board.

Another known package type is a surface horizontal package (“SHP”),which provides for the horizontal mounting of an integrated circuit chipto the circuit board. The integrated circuit is mounted inside a thinplastic package of the SHP and connected to metal leads residing on oneof the four of the thin sides of the plastic package of the SHP. The SHPchip has pins on an opposite side of the plastic package for aligningand mounting the chip. The metal leads of the SHP are soldered tometallic lines on a circuit board.

The connection of an SHP chip to a circuit board shares some of the sameproblems as the connection of an SVP chip to a circuit board. Leads ofthe SHP can be difficult to properly solder. The electrical connectionwith respect to the soldered leads must be tested, and an SHP must beresoldered if the solder connection is defective. Moreover, even goodsoldered leads of the SHP can deteriorate over time.

Users of computers or other electrical systems are typically unable toexpand the functionality of the system with the granularity of a singlesoldered SVP chip or soldered SHP chip in a relatively easy manner.Typical digital data processing systems with soldered SVP or SHP chipson circuit boards provide for user-expansion capabilities with thegranularity of a circuit board, rather than of a chip. Only by adding,removing, or replacing an entire circuit board can the user easily addor remove the functionality of a single chip.

SUMMARY AND OBJECTS OF THE INVENTION

One object of the present invention is to provide for the mechanical andelectrical connection of a chip to a circuit board without requiringthat the chip be soldered to the circuit board.

Another object of the present invention is to provide for the capabilityfor users to mechanically and electrically couple chips to a circuitboard with relative ease.

Another object of the present invention is to provide for the capabilityfor users to remove chips from a circuit board with relative ease.

Another object of the present invention is to provide for the capabilityfor users to replace chips mechanically and electrically coupled to acircuit board in a relatively easy manner.

Another object of the present invention is to provide for the capabilityfor users to expand the functionality of a system with the granularityof a single chip in a relatively easy manner.

Another object of the present invention is to provide for a relativelylow inductance connection in mechanically and electrically couplingchips to a circuit board.

A chip socket assembly is described. The chip socket assembly comprisesa base having a top, a bottom, and a connector. The base defines a slotfor receiving at the top of the base an edge of a chip and for guidingthe edge of the chip to the bottom of the base. The chip socket assemblyalso comprises a clip configured to mate with the connector of the basefor retaining the chip in the base when mating with the connector of thebase.

A system is described that comprises a circuit board having a surfaceand having a bus on the surface and a base coupled to the surface of thecircuit board over the bus. The base has a top and a bottom, and thebase defines a slot over the bus for receiving at the top of the base anedge of a chip and for guiding the edge of the chip to the bottom of thebase and over the bus.

A chip file assembly is described that comprises a base having a top, abottom, and a plurality of connectors. The base defines a plurality ofslots for receiving at the top of the base edges of a plurality of chipsand for guiding the edges of the chips to the bottom of the base. Thechip file assembly also comprises a plurality of clips configured tomate with the connectors of the base for retaining the chips in the basewhen mating with the connectors of the base.

Another system is described that comprises a circuit board having asurface and having at least one bus on the surface and a base coupled tothe surface of the circuit board over the at least one bus. The base hasa top and a bottom, and the base defines a plurality of slots over theat least one bus for receiving at the top of the base edges of aplurality of chips and for guiding the edges of the chips to the bottomof the base and over the at least one bus.

Another chip socket assembly is described that comprises a base having atop and a bottom. The base defines a slot for receiving at the top ofthe base an edge of a chip and for guiding the edge of the chip to thebottom of the base. The base has a clip portion configured to mate withthe chip for retaining the chip in the base when the chip is placed inthe slot of the base.

A chip package is described. The chip package includes packagingmaterial that contains an integrated circuit. The packaging material hasa bottom-facing housing that extends laterally from the packagingmaterial. A lead extends from a bottom of the packaging material. Thelead has a substantially C-shaped form. An end of the lead resideswithin the housing when the lead is compressed.

An assembly is also described. The assembly includes a horizontal chippackage, a socket, and a frame. The horizontal chip package includes amember on a side of the horizontal chip package. The socket receives thehorizontal chip package. The socket is coupled to a circuit board havinga first conductive region. The socket includes a guiding surface forguiding the member of the horizontal chip package in an angled downwarddirection. The frame is configured to mate with the socket to secure thehorizontal chip package in the socket. A lead of the horizontal chippackage is electrically coupled to the first conductive region of thecircuit board when the frame secures the horizontal chip package in thesocket.

Other objects, features, and advantages of the present invention will beapparent from the accompanying drawings and from the detaileddescription that follows below.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example and notlimitation in the figures of the accompanying drawings, in which likereferences indicate similar elements and in which:

FIG. 1 is a front view of a chip having a surface vertical package(SVP);

FIG. 2 is a bottom view of the chip of FIG. 1;

FIG. 3 is a perspective view of a system having the chip of FIG. 1;

FIG. 4 is an exploded, perspective view of one chip socket assembly;

FIG. 5 is a perspective view of the chip socket assembly of FIG. 4mechanically and electrically coupling a chip to a circuit board;

FIG. 6 is a top view of the chip socket assembly of FIG. 5;

FIG. 7 is a bottom view of the chip socket assembly of FIG. 5;

FIG. 8 is an exploded, perspective view of another chip socket assembly;

FIG. 9 is a perspective view of the chip socket assembly of FIG. 8mechanically and electrically coupling a chip to a circuit board;

FIG. 10 is a top view of the chip socket assembly of FIG. 9;

FIG. 11 is a bottom view of the chip socket assembly of FIG. 9;

FIG. 12 is an exploded, perspective view of a chip file assembly;

FIG. 13 is another perspective view of the chip file assembly of FIG.12;

FIG. 14 is a perspective view of a chip file assembly mechanically andelectrically coupling two chips to a circuit board;

FIG. 15 is a perspective view of a chip file assembly mechanically andelectrically coupling six chips to a circuit board;

FIG. 16 is an inner side view of the chip file assembly of FIG. 12;

FIG. 17 is an outer side view of the chip file assembly of FIG. 12;

FIG. 18 is a view of a chip socket assembly with a chip with side tabs;

FIG. 19 shows a vertical chip with side clips;

FIG. 20 is a side view of an edge-mountable chip with C-shapedcompressible leads before compression;

FIG. 21 is a side view of an edge-mountable chip with C-shapedcompressible leads after compression;

FIG. 22 is a side view of an edge-mountable chip with C-shapedcompressible leads with an elastomer center before compression;

FIG. 23 is a side view of an edge-mountable chip with C-shapedcompressible leads with an elastomer center after compression;

FIG. 24 is a side view of a circuit board with a wrap-around connectorcoupled to a motherboard;

FIG. 25 is an exploded view of wrap-around connector and a lower portionof the circuit board;

FIG. 26 shows a metal lead frame and connection pads of a circuit board;

FIG. 27 shows the metal lead frame after being cut, with the leads beingsoldered to the connection pads of the circuit board of FIG. 26;

FIG. 28 shows a vertically-mounted chip package with a ribbon connectorconnected to the upper portion of the chip package;

FIG. 29 shows a cam follower and leads of a vertical chip package;

FIG. 30 shows a slot molded into a chip file base;

FIG. 31 shows a sliding card guide over a chip file base;

FIG. 32 shows a horizontal chip package with side wedges, together witha socket and frame for receiving the horizontal chip package;

FIG. 33 is a side view of the horizontal chip package and a sidecut-away view of the socket and frame shown in FIG. 32;

FIG. 34 is a side view of the horizontal chip package inserted in thesocket and frame shown in FIG. 33;

FIG. 35 is a perspective view of a socket with a lever and clamp;

FIG. 36 is a side cut-away view of the socket of FIG. 35 with ahorizontal chip package secured in the socket;

FIG. 37 is a side view of a clip with a perpendicular member thatsecures a horizontal chip package; and

FIG. 38 is a side view of a planar clip secured by a tab in a base,together with a horizontal chip package that is secured by the clip.

DETAILED DESCRIPTION

The following detailed description sets forth embodiments of chip socketassemblies and chip file assemblies for semiconductor chips.

FIG. 1 illustrates a front view of prior art chip 100. Chip 100 has atop 101, a bottom 102 opposite top 101, a left side 103, a right side104 opposite left side 103, a front 105, and a rear 106 opposite front105. FIG. 2 illustrates a bottom view of prior art chip 100.

Chip 100 is an edge-mountable chip and has an electrical device packagedin a surface vertical package (“SVP”) 110 that is approximately 433 milsin height from top 101 to bottom 102, approximately 984 mils in widthfrom left side 103 to right side 104, and approximately 47 mils inthickness from front 105 to rear 106.

Chip 100 includes thirty-two leads 112 that provide for an electricalconnection to an electrical device packaged in chip 100. Leads 112 areeach approximately 13 mils in width from left to right, and the centersof leads 112 are spaced approximately 26 mils away from each other. Thecenters of the first and last of leads 112 are each at a maximumdistance of approximately 102 mils from left side 103 and right side104, respectively. The centers of the first and last of leads 112 areapproximately 793 mils apart from one another. Leads 112 each extendapproximately 20 mils downward from bottom 102 and are bentsubstantially perpendicular to extend approximately 30 mils toward front105.

Chip 100 further includes four support pins 114, 115, 116, and 117 tohelp support chip 100 in standing upright on bottom 102. Each supportpin 114-117 is approximately 20 mils in width and extends approximately20 mils downward from bottom 102. The center of support pin 114 islocated approximately 35 mils to the left of the right edge of supportpin 115. Support pin 115 is located to the left of leads 112. Supportpin 114 is bent substantially perpendicular to extend toward front 105.Support pin 115 is bent substantially perpendicular to extend towardrear 106. Support pins 114 and 115 together span a maximum distance ofapproximately 150 mils from front 105 to rear 106. The center of supportpin 117 is located approximately 35 mils to the right of the left edgeof support pin 116. Support pin 116 is located to the right of leads112. Support pin 117 is bent substantially perpendicular to extendtoward front 105. Support pin 116 is bent substantially perpendicular toextend toward rear 106. Support pins 116 and 117 together span a maximumdistance of approximately 150 mils from front 105 to rear 106. Thecenter point between support pins 114-115 is approximately 913 milsapart from the center point between support pins 116-117.

FIG. 3 illustrates a perspective view of a prior art digital dataprocessing system 300. System 300 includes a circuit board 302. System300 also includes a set of eight dynamic random access memory (“DRAM”)chips 310, four expansion sockets 320, 330, 340, and 350, an applicationspecific integrated circuit (“ASIC”) chip 360, and a central processingunit (“CPU”) chip 370. Prior art DRAM chips 310, expansion sockets 320,330, 340, and 350, ASIC chip 360, and CPU chip 370 are mounted on priorart circuit board 302 and are electrically coupled to one another alonga primary channel of system 300.

System 300 also includes prior art modules 321, 331, 341, and 351.Modules 321, 331, 341, and 351 comprise respective a circuit boards 322,332, 342, and 352 plugged into respective expansion sockets 320, 330,340, and 350. Modules 321, 331, and 341 are memory modules and eachincludes a set of nine DRAM chips 323, 333, and 343, respectively. Eachset of DRAM chips 323, 333, and 343 is mounted on circuit board 322,332, and 342, respectively, and is electrically coupled to the primarychannel of system 300. DRAM chips 323 are electrically coupled to oneanother along a secondary channel of system 300. DRAM chips 333 areelectrically coupled to one another along a secondary channel of system300. DRAM chips 343 are electrically coupled to one another along asecondary channel of system 300. Module 351 includes a set of two DRAMchips 353 and an ASIC chip 354. DRAM chips 353 and ASIC chip 354 aremounted on circuit board 352 and are electrically coupled to the primarychannel of system 300. DRAM chips 353 and ASIC chip 354 are electricallycoupled to one another along a secondary channel of system 300.

Each DRAM chip of sets 310, 323, 333, 343, and 353 is packaged in a SVPpackage, such as the chip package 100 of FIGS. 1 and 2. To mechanicallyand electrically connect such DRAM chip packages to their respectivecircuit boards, the leads of each DRAM chip package are each typicallysoldered. The supporting pins of the DRAM chip help to support the DRAMchip in standing upright while soldering the DRAM chip to the circuitboard.

In soldering the DRAM chip to the circuit board, the DRAM chip maynevertheless fall over and thus have to be resoldered to the circuitboard. Even after soldering the DRAM chip to the circuit board, theelectrical connection between the DRAM chip and the circuit board shouldbe tested to ensure each lead of the DRAM chip has been properly alignedwith and soldered to its respective solder pad on the circuit board.

The solder connection between the DRAM chip and the circuit board maydeteriorate sometime during the life of the circuit board beingsubjected to various mechanical stresses.

Users are also unable to expand the functionality of system 300 with thegranularity of a single chip in a relatively easy manner. System 300provides for user-expansion capabilities with the granularity of acircuit board, for example by inserting circuit boards into and removingcircuit boards from expansion slots 320, 330, 340, and 350. But DRAMchips 310, 323, 333, 343, and 353 are soldered to circuit boards 302,321, 331, 341, and 351.

FIG. 4 illustrates an exploded, perspective view of a chip socketassembly 400, which is one embodiment of the present invention. Chipsocket assembly 400 is also referred to as a device, an apparatus, or achip socket, for example. Chip socket assembly 400 may be used tomechanically and electrically couple a chip 440 to a bus of a circuitboard 502 as illustrated in FIG. 5. FIG. 6 illustrates a top view ofchip socket assembly 400. FIG. 7 illustrates a bottom view of chipsocket assembly 400. Chip socket assembly 400 includes a base 410 forreceiving and guiding chip 440 and also includes a retaining clip 430for helping to retain chip 440 in base 410.

Base 410 has a top 411, a bottom 412 opposite top 411, a left side 413,a right side 414 opposite left side 413, a front 415, and a rear 416opposite front 415. Base 410 may have any suitable dimensions that maydepend, for example, on the dimensions of chip 440. For one embodiment,base 410 may have a thickness from front 415 to rear 416 in the range ofapproximately 200 mils to approximately 250 mils, for example, a widthfrom left side 413 to right side 414 in the range of approximately 1450mils to approximately 1500 mils, for example, and a height from top 411to bottom 412 of approximately 200 mils, for example. Base 410 may beformed from any suitable material, such as a plastic or metal, forexample. Base 410 may be formed with a suitable material so as to serveas a heat sink in coupling chip 440 to circuit board 502. Base 410 maybe formed so as to conduct heat into circuit board 502, for example.

Base 410 defines a slot 420 configured to receive and guide chip 440.Chip 440 includes an electrical device packaged in an edge-mountablepackage. Although illustrated in FIGS. 4-7 as being packaged in asurface vertical package (SVP) similar to chip 100 of FIGS. 1 and 2,chip 440 may be packaged in any suitable edge-mountable package, forexample. Chip 440 may include any suitable electrical device configuredin any suitable form. Chip 440 may include DRAM memory configured as anintegrated circuit, for example. Chip 440 may include digital dataprocessing circuitry configured as an integrated circuit, for example.

Chip 440 has thirty-two leads 442 and two support pins 445-446. Foralternative embodiments, Chip 440 has other suitable numbers of leads442 and support pins 445-446. Leads 442 correspond to leads 112 of chip100 of FIGS. 1 and 2. Support pins 445 and 446 correspond to supportpins 115 and 116 of chip 100 of FIGS. 1 and 2. For other embodiments(not shown), Chip 440 does not have outermost support pins 445 and446—they are either removed or not put into Chip 440 to begin with.

Slot 420 has an opening at top 411 and an opening at bottom 412. Slot420 also has a left end 423 and a right end 424 opposite left end 423.Slot 420 is configured to receive at top 411 the bottom of chip 440 andto guide chip 440 to bottom 412, exposing at bottom 412 leads 442 ofchip 440 as illustrated in FIG. 5. Slot 420 may have any suitabledimensions that may depend, for example, on the dimensions of chip 440.For one embodiment, slot 420 may have a length from left end 423 toright end 424 in the range of approximately 1000 mils to approximately1100 mils, for example, and a width from front to rear of approximately50 mils, for example.

Slot 420 also includes left support pin guide 425 and right support pinguide 426. Left support pin guide 425 is configured to receive and guidesupport pin 445 of chip 440 as chip 440 is placed in slot 420. Rightsupport pin guide 426 is configured to receive and guide support pin 446of chip 440 as chip 440 is placed in slot 420. Support pin guides 425and 426 in conjunction with support pins 445 and 446 may help to alignexposed leads 442 at bottom 412 with respect to slot 420, as illustratedin FIGS. 6 and 7.

As illustrated in FIG. 5, base 410 exposes at front 415 at least aportion of slot 420, exposing at least a portion of the front of chip440 at front 415 when chip 440 has been placed in slot 420. Base 410 mayalso be configured to define slot 420 such that base 410 has acontinuously solid side at front 415.

Clip 430 helps to retain chip 440 in slot 420. Clip 430 and base 410 maybe configured to mate with one another in any suitable manner to helpretain chip 440 in slot 420. For one embodiment, base 410 includes knobsor protuberances 417 and 418 configured to mate with clip 430.

Protuberance 417 is located at the end of base 410 at left side 413.Protuberance 417 may have any suitable shape and dimensions. As oneexample, protuberance 417 may have a width from front 415 to rear 416 ofapproximately 125 mils, for example, a height from top 411 to bottom 412of approximately 150 mils, for example, and a thickness from left toright of approximately 50 mils, for example. Protuberance 418 is locatedat the end of base 410 at right side 414. Protuberance 418 may have anysuitable shape and dimensions. As one example, protuberance 418 may havea width from front 415 to rear 416 of approximately 125 mils, forexample, a height from top 411 to bottom 412 of approximately 150 mils,for example, and a thickness from left to right of approximately 50mils, for example.

Clip 430 may have any suitable shape and dimensions that may depend, forexample, on the shape and dimensions of protuberances 417 and 418, base410, and chip 440. Clip 430 may be formed from any suitable material,such as a plastic or metal, for example. Clip 430 may be formed with asuitable material so as to serve as an integral heat sink in couplingchip 440 to circuit board 502. Clip 430 may also be configured so as toserve as a shipping and handling device for chip socket assembly 400.For an alternative embodiment, clip 430 is molded as an integral part ofthe package for chip 440.

For one embodiment, clip 430 includes a left connector 433 having anopening to mate with protuberance 417 and also includes a rightconnector 434 having an opening to mate with protuberance 418. Clip 430includes a bridge structure 435 connecting left connector 433 and rightconnector 434. When clip 430 is connected to mate with base 410, bridgestructure 435 overlies chip 440 and helps to retain chip 440 in base410, as illustrated in FIGS. 5 and 6.

In mechanically and electrically coupling chip 440 to circuit board 502,as illustrated in FIG. 5, base 410 is coupled or fastened to circuitboard 502 over suitable pads or other suitable electrical connectors ofa bus to which chip 440 is to be electrically coupled. Base 410 may becoupled or fastened to circuit board 502 in any suitable manner usingany suitable structures and techniques.

For one embodiment, base 410 may include a left opening 453 and a rightopening 454, as illustrated in FIG. 4, for coupling base 410 to circuitboard 502. Left opening 453 is located near left side 413 betweenprotuberance 417 and left end 423 of slot 420. Left opening 453 mayreceive and guide a bolt or screw 455 to pass from top 411 through base410 to bottom 412. Right opening 454 is located near right side 414between protuberance 418 and right end 424 of slot 420. Right opening454 may receive and guide a bolt or screw 456 to pass from top 411through base 410 to bottom 412. Left and right openings 453 and 454 maybe positioned in other suitable locations of base 410. Circuit board 502may be configured with suitable openings to mate with bolts or screws455 and 456 in fastening base 410 to circuit board 502, as illustratedin FIG. 5. For other embodiments, other suitable fasteners such as glueor rivets, for example, may be used to couple base 410 to circuit board502.

To help align leads 442 of chip 440 with the bonding pads or othersuitable electrical connectors for a bus to which chip 440 is to beelectrically coupled, base 410 may include one or more suitablealignments pins for aligning base 410 with respect to the bus to helpprovide for a suitable electrical connection between chip 440 and thebus of circuit board 502. Although the use of bolts, screws, or rivets,for example, help to align base 410 with respect to the bus of circuitboard 502 in fastening base 410 to circuit board 502, alignment pinshelp to ensure leads 442 are suitably aligned within the relativelytighter tolerances required in aligning leads 442 with the bus ofcircuit board 502.

For one embodiment, base 410 may include alignment pins 457 and 458 asillustrated in FIGS. 5 and 7. Alignment pin 457 protrudes from bottom412 near left side 413 between protuberance 417 and left end 423 of slot420. Alignment pin 458 protrudes from bottom 412 near right side 414between protuberance 418 and right end 424 of slot 420. Alignment pins457 and 458 may be positioned in other suitable locations of base 410.Circuit board 502 may be configured with suitable openings to mate withalignment pins 457 and 458 so as to help ensure leads 442 of chip 440are suitably aligned with the bus of circuit board 502. For otherembodiments, circuit board 502 may be configured with suitable alignmentpins to mate with suitable openings in base 410 to help align leads 442of chip 440 with the bus of circuit board 502.

The package of chip 440 may be used to help align leads 442 with the busof circuit board 502 by controlling the length of slot 420 and thepositioning of leads 442 with respect to the package of chip 440. Forother embodiments, the positioning of support pins 445 and 446 withrespect to leads 442 may be controlled. Support pin guides 425 and 426in conjunction with support pins 445 and 446 may then help to alignleads 442 of chip 440 with the bus of circuit board 502, as illustratedin FIGS. 6 and 7.

Once chip 440 is placed in slot 420 and aligned with the bus of circuitboard 502, clip 430 may be coupled to base 410 to help retain chip 440in base 410. Clip 430 may also be configured to mate with base 410 suchthat bridge structure 435 applies pressure over the top of chip 440 tomaintain the electrical connection between leads 442 and the bus ofcircuit board 502.

For one embodiment, leads 442 of chip 440 may be placed directly overthe bus of circuit board 502. For other embodiments, a suitableconductive interconnect may be used between leads 442 and the bus ofcircuit board 502. As one example, an elastomeric connector sheet 460,also called an anisotropic conductor sheet, may be configured betweenchip 440 and the bus of circuit board 502 so as to provide for asuitable electrical connection between leads 442 and the bus of circuitboard 502. Elastomeric connector sheet 460 has a top 461 and a bottom462. Elastomeric connector sheets are available under the name of MAFInter-connector from Shin-Etsu Polymer America, Inc. of Union City,Calif., for example.

Elastomeric connector sheet 460 conducts electrical signals only in asubstantially vertical direction between top 461 and bottom 462.Elastomeric connector sheet 460 provides for a relatively low inductanceconnection between leads 442 and the bus of circuit board 502.Elastomeric connector sheet 460 provides for relatively minimized signaldegradation and may be used for relatively high frequencies inconducting electrical signals between leads 442 and the bus of circuitboard 502. Elastomeric connector sheet 460 may therefore provide forrelatively accurate testing of chip 440.

Elastomeric connector sheet 460 may have any suitable shape and anysuitable dimensions. As one example, elastomeric connector sheet 460 maybe rectangular in shape. Elastomeric connector sheet 460 may have alength from left to right in the range of approximately 1000 mils toapproximately 1100 mils, for example, a width from front to rear ofapproximately 200 mils, for example, and a thickness from top 461 tobottom 462 in the range of approximately 5 mils to approximately 50mils, for example.

Elastomeric connector sheet 460 may be mounted between chip 440 and thebus of circuit board 502 in any suitable manner using any suitabletechnique. As elastomeric connector sheet 460 conducts electricalsignals only in substantially vertical directions between top 461 andbottom 462, elastomeric connector sheet 460 may be mounted between chip440 and the bus of circuit board 502 with minimized concern forelectrical shorts, for example, despite accidental electrical contactsmade between elastomeric connector sheet 460 and other conductivestructures of chip socket assembly 400, for example, bolts or screws 455and 456, or other conductive structures of circuit board 502.

For one embodiment, elastomeric connector sheet 460 is placed over thebus of circuit board 502 and retained between base 410 and the bus ofcircuit board 502 by fastening base 410 to circuit board 502. For otherembodiments, as illustrated in FIGS. 4-7, base 410 may be configured atbottom 412 with a recess 465 for aligning and mounting elastomericconnector sheet 460 between leads 442 and the bus of circuit board 502.Recess 465 may have any suitable dimensions. As one example, recess 465may have an indentation in bottom 412 of base 410 of approximately 15mils, for example, a length from left to right of approximately that ofslot 420, for example, and a width from front to rear of approximatelythat of base 410, for example. Elastomeric connector sheet 460 may befitted in recess 465 and held beneath base 410 when base 410 is fastenedto circuit board 502. Clip 430 may also help to retain elastomericconnector sheet 460 in recess 465 as clip 430 may apply pressure overthe top of chip 440 in securing chip 440 in base 410. Elastomericconnector sheet 460 may also be glued in recess 465.

With chip socket assembly 400, users may mechanically and electricallycouple single chips 440 to a circuit board with relative ease by placingchip 440 in base 410 and attaching clip 430 to base 410 to retain chip440 in base 410. As chip socket assembly 400 may be used to couple chip440 to a circuit board without requiring that chip 440 be soldered tothe circuit board, users may also remove single chips 440 with relativeease by detaching clip 430 from base 410 and removing chip 440 from base410. Users may therefore expand the functionality of a system with thegranularity of a single chip in a relatively easy manner by adding orreplacing single chips in the system. For system 300 of FIG. 3, forexample, users may use a separate chip socket assembly 400 tomechanically and electrically couple each DRAM chip of sets 310, 323,333, 343, and 353 to its respective circuit board 302, 321, 331, 341,and 351. Users may then expand the functionality of system 300 with thegranularity of a single chip in a relatively easy manner without havingto add or replace an entire circuit board 302, 321, 331, 341, and/or351, for example.

FIG. 8 is an exploded, perspective view of chip socket assembly 800which is another embodiment of the present invention. Chip socketassembly 800 is also referred to as a device, an apparatus, or a chipsocket, for example. Chip socket assembly 800 may be used tomechanically and electrically couple a chip 840 to a bus of a circuitboard 902 as illustrated in FIG. 9. FIG. 10 illustrates a top view ofchip socket assembly 800. FIG. 11 illustrates a bottom view of chipsocket assembly 800. Chip socket assembly 800 includes a base 810 forreceiving and guiding chip 840 and also includes a retaining clip 830for helping to retain chip 840 in base 810. Elements designated byreference numerals 800-865 and 902 in FIGS. 8-11 are functionallysimilar to elements 400-465 and 502 of FIGS. 4-7, respectively. Chipsocket assembly 800 may be used similarly as chip socket assembly 400.

Base 810 and clip 830 are configured to mate in a different manner ascompared to base 410 and clip 430 of FIGS. 4-7. Clip 830 includes a leftmale connector 833 and a right male connector 834. Base 810 includes aleft socket 817 and a right socket 818. Left male connector 833 and leftsocket 817 may be configured in any suitable manner to mate with oneanother. Right male connector 834 and right socket 818 may also beconfigured in any suitable manner to mate with one another.

For one embodiment, left male connector 833 has a protruding ledge 873and is tapered from left to right from protruding ledge 873 down towardthe tip end of left male connector 833. Left socket 817 has an upper lip877. In connecting clip 830 to base 810, left male connector 833 may beinserted into left socket 817 until protruding ledge 873 snaps in placebeneath upper lip 877. Left male connector 833 may be removed from leftsocket 817 by pushing left male connector 833 inward toward the rightuntil protruding ledge 873 is no longer beneath upper lip 877 whilelifting left male connector 833 out of left socket 817.

Right male connector 834 has a protruding ledge 874 and is tapered fromleft to right from protruding ledge 874 down toward the tip end of rightmale connector 834. Right socket 818 has an upper lip 878. In connectingclip 830 to base 810, right male connector 834 may be inserted intoright socket 818 until protruding ledge 874 snaps in place beneath upperlip 878. Right male connector 834 may be removed from right socket 818by pushing right male connector 834 inward toward the left untilprotruding ledge 874 is no longer beneath upper lip 878 while liftingright male connector 834 out of right socket 818.

Although illustrated as having specific configurations for attachingclips 430 and 830 to bases 410 and 810, respectively, other suitablemating configurations may be used for attaching a clip to a base insecuring a chip with a chip socket assembly. As one example, the clipand base may be configured such that the clip may be screwed or boltedonto the base.

FIG. 12 illustrates an exploded, perspective view of a chip fileassembly 1200. FIG. 13 illustrates a perspective view of chip fileassembly 1200 connected together. Chip file assembly 1200 is alsoreferred to as a device, an apparatus, a chip file, or a chip cage, forexample. Chip file assembly 1200 may be used to mechanically andelectrically couple one or more chips 1240 to one or more buses of acircuit board 1402 as illustrated in FIGS. 14 and 15. FIG. 14illustrates a perspective view of chip file assembly 1200 mechanicallyand electrically coupling two chips to circuit board 1402. FIG. 15illustrates a perspective view of chip file assembly 1200 mechanicallyand electrically coupling six chips to circuit board 1402.

Chip file assembly 1200 includes a left base portion 1210 and a rightbase portion 1220 for receiving and guiding one or more chips 1240. Baseportions 1210 and 1220 together define a base. Chip file assembly 1200also includes retaining clips 1230 for helping to retain chips 1240 inbase portions 1210 and 1220.

Left base portion 1210 has a top 1211, a bottom 1212 opposite top 1211,an outer side 1213, an inner side 1214 opposite outer side 1213, a front1215, and a rear 1216 opposite front 1215. Left base portion 1210 mayhave any suitable dimensions. For one embodiment, left base portion 1210may have a width from outer side 1213 to inner side 1214 ofapproximately 400 mils, for example, and a height from top 1211 tobottom 1212 of approximately 200 mils, for example. The length of leftbase portion 1210 from front 1215 to rear 1216 may vary and may depend,for example, on the desired number of chips 1240 that are capable ofbeing held in chip file assembly 1200. Base portion 1210 may be formedfrom any suitable material, such as a plastic or metal, for example.Base portion 1210 may be formed with a suitable material so as to serveas a heat sink in coupling chips 1240 to circuit board 1402. Baseportion 1210 may be formed so as to conduct heat into circuit board1402, for example.

Right base portion 1220 has a top 1221, a bottom 1222 opposite top 1221,an outer side 1223, an inner side 1224 opposite outer side 1223, a front1225, and a rear 1226 opposite front 1225. Right base portion 1220 mayhave any suitable dimensions. Right base portion 1220 may have a widthfrom outer side 1223 to inner side 1224 of approximately 400 mils, forexample, and a height from top 1221 to bottom 1222 of approximately 200mils, for example. The length of right base portion 1220 from front 1225to rear 1226 may vary and may depend, for example, on the desired numberof chips 1240 that are capable of being held in chip file assembly 1200.Base portion 1220 may be formed from any suitable material, such as aplastic or metal, for example. Base portion 1220 may be formed with asuitable material so as to serve as a heat sink in coupling chips 1240to circuit board 1402. Base portion 1220 may be formed so as to conductheat into circuit board 1402, for example.

Inner side 1214 and 1224 are each corrugated with a set of slots orgrooves 1217 and 1227, respectively, that traverse inner side 1214 and1224, respectively, from top 1211 and 1221, respectively, to bottom 1212and 1222, respectively. The number of slots 1217 and 1227 may vary andmay depend, for example, on the desired number of chips 1240 that arecapable of being held in chip file assembly 1200. Base portions 1210 and1220 may each have thirty-two slots for holding thirty-two chips 1240,as illustrated in FIGS. 14-15.

FIG. 16 illustrates inner side 1214 of left base portion 1210. Slots1217 may each have any suitable size and may be positioned in anysuitable location along inner side 1214. For one embodiment, slots 1217of inner side 1214 may be indented within left base portion 1210approximately 50 mils, for example, may have a width from front to backof approximately 50 mils, for example, and may be separated from thecenter of one another by approximately 300 mils, for example. Thecenters of first and last slots 1217 of inner side 1214 may be separatedfrom front 1215 and rear 1216, respectively, by approximately 375 mils,for example. For a left base portion 1210 having ten slots, for example,the length of left base portion from front 1215 to rear 1216 may beapproximately 3450 mils, for example. Inner side 1224 of right baseportion 1220 is similarly configured as inner side 1214.

Left base portion 1210 and right base portion 1220 may be positionedsuch that slots 1217 and 1227 are suitably aligned so as to receive andguide one or more chips 1240, as illustrated in FIGS. 12-15. The abovediscussion pertaining to chip 440 of FIGS. 4-7 likewise applies to eachchip 1240 of FIGS. 12-15. Leads 1242 and support pins 1245 and 1246correspond to leads 442 and support pins 445 and 446 of FIGS. 4-7. Eachslot 1217 is configured to receive at top 1211 a left end of a chip1240, from the bottom of chip 1240, and to guide the left end of chip1240 to bottom 1212, as illustrated in FIGS. 12-15. Each slot 1227 isconfigured to receive at top 1221 a right end of a chip 1240, from thebottom of chip 1240, and to guide the right end of chip 1240 to bottom1222, as illustrated in FIGS. 12-15.

Base portions 1210 and 1220 may be positioned away from one another byany suitable distance that may depend, for example, on the width of chip1240. For one embodiment, base portions 1210 and 1220 are positionedaway from each other in the range of approximately 900 mils toapproximately 1000 mils, for example. Left base portion 1210 and rightbase portion 1220 may also be positioned with respect to one anothersuch that support pins 1245 and 1246 help to align chip 1240 withrespect to base portions 1210 and 1220. Base portions 1210 and 1220 maybe positioned such that support pins 1245 and 1246 abut inner sides 1214and 1224, respectively, when chip 1240 is placed in slots 1217 and 1227.

Clips 1230 help to retain chips 1240 in chip file assembly 1200. Clips1230 and base portions 1210 and 1220 may be configured to mate with oneanother in any suitable manner to help retain chips 1240 in chip fileassembly 1200.

For one embodiment, outer side 1213 and 1223 are each configured withprotuberances 1218 and 1228, respectively, that are configured to matewith clips 1230. FIG. 17 illustrates outer side 1213 of left baseportion 1210. Protuberances 1218 may each have any suitable size and maybe positioned in any suitable location along outer side 1213.Protuberances 1218 are each suitably aligned along outer side 1213opposite a corresponding slot 1217.

For one embodiment, protuberances 1218 of outer side 1213 each has awidth from front 1215 to rear 1216 of approximately 125 mils, forexample, a height from top 1211 to bottom 1212 of approximately 150mils, for example, and a thickness from left to right of approximately50 mils, for example. Protuberances 1218 may be separated from thecenter each other by approximately 300 mils, for example. The centers offirst and last protuberances 1218 of outer side 1213 may be separatedfrom front 1215 and rear 1216, respectively, by approximately 375 mils,for example. Outer side 1223 of right base portion 1220 is similarlyconfigured as outer side 1213.

Clips 1230 may each have any suitable shape and dimensions that maydepend, for example, on the shape and dimensions of protuberances 1218and 1228, base portions 1210 and 1220, and chip 1240. Clips 1230 may beformed from any suitable material, such as a plastic or metal, forexample. Clips 1230 may be formed with a suitable material so as toserve as an integral heat sink in coupling chips 1240 to circuit board1402. Clips 1230 may further be molded as an integral part of thepackage for chips 1240.

For one embodiment, each clip 1230 includes a left connector 1233 havingan opening to mate with protuberance 1218. Each clip 1230 also includesa right connector 1234 having an opening to mate with protuberance 1228.Each clip 1230 includes a bridge structure 1235 connecting leftconnector 1233 and right connector 1234. When clip 1230 is connected tomate with base portions 1210 and 1220, bridge structure 1235 overlieschip 1240 and helps to retain chip 1240 in chip file assembly 1200, asillustrated in FIGS. 13-15.

Although illustrated as having specific configurations for attachingclips 1230 to base portions 1210 and 1220, other suitable matingconfigurations may be used for attaching clips 1230 to base portions1210 and 1220 in securing chips 1240 with chip file assembly 1200. Asone example, clips 1230 and base portions 1210 and 1220 may beconfigured to mate with one another similarly as clip 830 and base 810of FIGS. 8-11 As another example, each clip 1230 and base portions 1210and 1220 may be configured such that clips 1230 may be screwed or boltedonto base portions 1210 and 1220.

In mechanically and electrically coupling one or more chips 1240 to oneor more buses of circuit board 1402, as illustrated in FIGS. 14 and 15,base portions 1210 and 1220 are coupled or fastened to circuit board1402 over suitable pads or other suitable electrical connectors to whicheach chip 1240 is to be electrically coupled. Base portions 1210 and1220 may be coupled or fastened to circuit board 1402 in any suitablemanner using any suitable structures and techniques.

For one embodiment as illustrated in FIG. 12, base portions 1210 and1220 may include openings 1253 and 1254, respectively, for coupling baseportions 1210 and 1220, respectively, to circuit board 1402. Opening1253 may receive and guide a bolt or screw 1255 to pass from top 1211through base portion 1210 to bottom 1212. Opening 1254 may receive andguide a bolt or screw 1256 to pass from top 1221 through base portion1220 to bottom 1222. Openings 1253 and 1254 may be positioned in anysuitable location of base portions 1210 and 1220. Circuit board 1402 maybe configured with suitable openings to mate with bolts or screws 1255and 1256 in fastening base portions 1210 and 1220 to circuit board 1402,as illustrated in FIGS. 14-15. Base portions 1210 and 1220 may beconfigured with any suitable number of openings for coupling baseportions 1210 and 1220 to circuit board 1402. As one example, baseportions 1210 and 1220 may each be configured with two openings asillustrated in FIGS. 14-15. For other embodiments, other suitablefasteners such as glue or rivets, for example, may be used to couplebase portions 1210 and 1220 to circuit board 1402.

To help align leads 1242 of each chip 1240 with the bonding pads orother suitable electrical connectors to which each chip 1240 is to beelectrically coupled, base portions 1210 and 1220 may include one ormore suitable alignments pins for aligning base portions 1210 and 1220with respect to circuit board 1402 to help provide for a suitableelectrical connection between each chip 1240 and a bus of circuit board1402. Although the use of bolts, screws, or rivets, for example, help toalign base portions 1210 and 1220 with respect to one or more buses ofcircuit board 1402 in fastening base portions 1210 and 1220 to circuitboard 1402, alignment pins help to ensure leads 1242 of each chip 1240are suitably aligned within the relatively tighter tolerances requiredin aligning leads 1242 of each chip 1240 with a bus of circuit board1402.

For one embodiment, base portions 1210 and 1220 each includes alignmentpins that protrude from bottom 1212 and 1222, similar to alignment pins457 and 458 of FIGS. 5 and 7. Such alignment pins may be positioned inany suitable location of base portions 1210 and 1220. Circuit board 1402is configured with suitable openings to mate with such alignment pins soas to help ensure leads 1242 of each chip 1240 are suitably aligned witha bus of circuit board 1402. For other embodiments, circuit board 1402may be configured with suitable alignment pins to mate with suitableopenings in base portions 1210 and 1220 to help align leads 1242 of eachchip 1240 with a bus of circuit board 1402.

The package of each chip 1240 may be used to help align leads 1242 witha bus of circuit board 1402 by controlling the distance between slots1217 and 1227 and the positioning of leads 1242 with respect to thepackage of each chip 1240. For other embodiments, the positioning ofsupport pins 1245 and 1246 with respect to leads 1242 may be controlledfor each chip 1240. Base portions 1210 and 1220 in conjunction withsupport pins 1245 and 1246 may then help to align leads 1242 of eachchip 1240 with a bus of circuit board 1402.

Once a chip 1240 is placed in slots 1217 and 1227 and aligned with a busof circuit board 1402, clip 1230 may be coupled to base portions 1210and 1220 to help retain chip 1240 between base portions 1210 and 1220.Clip 1230 may also be configured to mate with base portions 1210 and1220 such that bridge structure 1235 applies pressure over the top ofchip 1240 to maintain the electrical connection between leads 1242 ofchip 1240 and a bus of circuit board 1402.

For one embodiment, leads 1242 of chip 1240 are placed directly over abus of circuit board 1402. For other embodiments, a suitable conductiveinterconnect is used between leads 1242 and a bus of circuit board 1402.As one example, an elastomeric connector sheet 1260 is configuredbetween each chip 1240 and a bus of circuit board 1402 so as to providefor a suitable electrical connection between leads 1242 of chip 1240 anda bus of circuit board 1402. Elastomeric connector sheet 1260 has a top1261 and a bottom 1262.

Elastomeric connector sheet 1260 is similar to elastomeric connectorsheet 460 of FIGS. 4-7. Elastomeric connector sheet 1260 may have anysuitable shape and any suitable dimensions. As one example, elastomericconnector sheet 1260 may be rectangular in shape. Elastomeric connectorsheet 1260 may have a width from left to right in the range ofapproximately 1000 mils to approximately 1700 mils, for example, and athickness from top 1261 to bottom 1262 in the range of approximately 8mils to approximately 20 mils, for example. Elastomeric connector sheet1260 may have any suitable length from front to rear that may depend,for example, on the length of base portions 1210 and 1220. Althoughelastomeric connector sheet 1260 is illustrated as a single sheet,elastomeric connector sheet 1260 may include more than one suitablysized elastomeric connector sheet. As one example, a separateelastomeric connector sheet may be used as an interconnect for eachseparate chip 1240.

Elastomeric connector sheet 1260 may be mounted between chips 1240 andone or more buses of circuit board 1402 in any suitable manner using anysuitable technique. As elastomeric connector sheet 1260 conductselectrical signals only in substantially vertical directions between top1261 and bottom 1262, elastomeric connector sheet 1260 may be mountedbetween chips 1240 and one or more buses of circuit board 1402 withminimized concern for electrical shorts, for example, despite accidentalelectrical contacts made between elastomeric connector sheet 1260 andother conductive structures of chip file assembly 1200, for examplebolts or screws 1255 and 1256, or other conductive structures of circuitboard 1402, for example.

Elastomeric connector sheet 1260 may be placed over one or more buses ofcircuit board 1402 and retained beneath base portions 1210 and 1220 byfastening base portions 1210 and 1220 to circuit board 1402. For otherembodiments, elastomeric connector sheet 1260 may be sized so as to fitbetween base portions 1210 and 1220, covering one or more buses ofcircuit board 1402 without being fastened beneath base portions 1210 and1220. Elastomeric connector sheet 1260 may then be retained in securingone or more chips 1240 in chip file assembly 1200.

With chip file assembly 1200, users may mechanically and electricallycouple one or more chips 1240 to a circuit board with relative ease byplacing each chip 1240 between base portions 1210 and 1220 and attachingclip 1230 to base portions 1210 and 1220 to retain each chip 1240 inbase portions 1210 and 1220. As chip file assembly 1200 may be used tocouple each chip 1240 to a circuit board without requiring that eachchip 1240 be soldered to the circuit board, users may also remove singlechips 1240 with relative ease by detaching clip 1230 from base portions1210 and 1220 and removing chips 1240 from base portions 1210 and 1220.Users may therefore expand the functionality of a system with thegranularity of a single chip in a relatively easy manner by adding orreplacing single chips in the system.

FIG. 18 illustrates a chip socket assembly 1800. Chip socket assembly1800 is also referred to as a device, an apparatus, or a chip socket,for example. Chip socket assembly 1800 may be used to mechanically andelectrically couple a chip 1840 to a bus of a circuit board. Chip socketassembly 1800 includes a base 1810 for receiving and guiding chip 1840.Base 1810 also serves as a retaining clip for helping to retain chip1840 in base 1810. Chip socket assembly 1800 may be configured and usedsimilarly as chip socket assemblies 400 and 800 of FIGS. 4-11.

Chip socket assembly 1800 is configured to clip or retain chip 1840 inbase 1810 in a different manner as compared to base 410 and clip 430 ofFIGS. 4-7 and as compared to base 810 and clip 830 of FIGS. 8-11. Base1810 includes a left clip portion 1817 and a right clip portion 1818.Clip portions 1817 and 1818 may be configured to mate with the packageof chip 1840 in any suitable manner.

For one embodiment, left clip portion 1817 includes a socket 1877 havingan upper lip. The package of chip 1840 includes a protruding ledge 1833tapered downward and inward toward a left side of chip 1840. In securingchip 1840 in base 1810, chip 1840 may be pushed down into base 1810until protruding ledge 1833 snaps in place beneath the upper lip ofsocket 1877. Chip 1840 may be removed from base 1810 by pushing leftclip portion 1817 outward toward the left until protruding ledge 1833 isno longer beneath the upper lip of socket 1877 while lifting chip 1840from base 1810.

Right clip portion 1818 includes a socket 1878 having an upper lip. Thepackage of chip 1840 includes a protruding ledge 1834 tapered downwardand inward toward a right side of chip 1840. In securing chip 1840 inbase 1810, chip 1840 may be pushed down into base 1810 until protrudingledge 1834 snaps in place beneath the upper lip of socket 1878. Chip1840 may be removed from base 1810 by pushing right clip portion 1818outward toward the right until protruding ledge 1834 is no longerbeneath the upper lip of socket 1878 while lifting chip 1840 from base1810. In short, for the embodiment shown in FIG. 18, clips 1817 and 1818are relatively flexible. In contrast, chip 1840 and ledges 1833 and 1844are relatively rigid.

Chip 1840 may configured with a package molded to form protruding ledges1833 and 1834 as illustrated in FIG. 18. For other embodiments,protruding ledges 1833 or 1834 or other suitable clipping structures maybe attached to the package of chip 1840. Base 1810 may be formed fromany suitable material, such as a plastic or metal, for example. Base1810 may be formed with a suitable material so as to serve as a heatsink in coupling chip 1840 to a circuit board. Base 1810 may be formedso as to conduct heat into the circuit board, for example.

Chip file assembly 1200 of FIGS. 12-17 may also be configured withsuitable clip portions similar to clip portions 1817 and 1818 of FIG. 18so as to retain a plurality of chips similar to chip 1840 between baseportions 1210 and 1220.

FIG. 19 shows chip socket assembly 1900. Chip socket assembly 1900 isalso referred to as a device, an apparatus, or a chip socket, forexample. Chip socket assembly includes chip 1914 and base 1910.

Chip 1900 is an edge-mountable vertical chip package with a left arm1901 and a right arm 1903. Arms 1901 and 1903 are also referred to asclips 1901 and 1903. Clips 1901 and 1903 are relatively flexible, andcan be flexed inward when a clip 1900 is being inserted or removed froma base. For one embodiment, chip 1900 can be inserted into a base 1910that has sockets 1977 and 1978. The ledges 1902 and 1904 of respectivearms 1901 and 1903 fit into and are secured by respective sockets 1977and 1978.

For the embodiment shown in FIG. 19, posts 1917 and 1918 of base 1910are relatively rigid. Posts 1917 and 1918 are also referred to as clips1917 and 1918. The insertion and removal of chip 1900 is done by flexingarms 1901 and 1903, which are relatively flexible.

For alternative embodiments, clips 1917 and 1918 of base 1910 arerelatively flexible, and arms 1901 and 1903 are also flexible.

Chip file assembly 1200 of FIGS. 12-17 may alternatively be configuredwith suitable posts similar to posts 1917 and 1918 of FIG. 19 so as toretain a plurality of chips similar to chip 1914.

A chip socket assembly and chip file assembly may be used tomechanically and electrically couple any suitable edge-mountable chip toa bus of a circuit board. As discussed above, suitable SVP packagedchips having L-shaped leads similar to chip 100 of FIGS. 1 and 2 may bemounted over a bus of a circuit board with a chip socket assembly or achip file assembly. A chip socket assembly and chip file assembly may beused to mount other suitable edge-mountable chips having other suitablelead structures over a bus of a circuit board. As one example, suitableedge-mountable chips having C-shaped leads may also be mounted over abus of a circuit board with a chip socket assembly or a chip fileassembly. FIG. 20 illustrates a side view of an edge-mountable chip 1940having such C-shaped leads 1942.

As illustrated in FIG. 20, leads 1942 extend from the bottom of chip1940 and are bent to form a C-shape toward the front side of chip 1940.Leads 1942 extend into a pocket or indentation formed by an extendedportion 1941 of chip 1940. The pocket formed by extended portion 1941helps to protect leads 1942 from being snagged, broken, or bent as aresult of any mishaps in handling chip 1940.

Leads 1942 may be formed from any suitable material. As one example,leads 1942 may be formed from a springy metal such that leads 1942 maybecome relatively compliant when subjected to stress in retaining chip1940 in a chip socket assembly or in a chip file assembly. For oneembodiment, springy leads 1942 are comprised of beryllium-copper. For analternative embodiment, chip package 1940 can be comprised of moldedsilicon rubber. For that embodiment, leads 1942 are connected to themolded silicon rubber of chip package 1940. The silicon rubber of chippackage 1940 supplies spring force for leads 1942 for that embodiment.The leads 1942 can also have their own additional spring force.

FIG. 21 shows leads 1942 in a compressed state, as exists when chip 1940is mounted over surface 1943. In the compressed state, leads 1942electrically and mechanically contact surface 1943. For one embodiment,surface 1943 is an elastomeric connector sheet. For another embodiment,surface 1943 is a metallic surface on a printed circuit board. Themetallic surface can, for example, be a bus. A chip socket assembly orchip file assembly may be used to mount a chip 1940 directly over a busof a circuit board without a separate interconnect, such as anelastomeric connector sheet, and provide for a relatively low inductanceconnection between leads 1942 and the bus.

For another embodiment, an edge-mountable chip 2040 may have C-shapedleads 2042 that wrap around a cylinder 2080 extending along the bottomof chip 2040 from left to right, as illustrated in FIG. 20. Leads 2042extend into a pocket or indentation formed by an extended portion 2041of chip 2040. The pocket formed by extended portion 2041 helps toprotect leads 2042 from being snagged, broken, or bent as a result ofany mishaps in handling chip 2040.

Leads 2042 may be formed from any suitable springy material. Forexample, leads 2042 may be comprised of beryllium-copper. Cylinder 2080may be formed from any relatively compliant material, such as anelastomer, such that leads 2042 may become compliant when subjected tostress in retaining chip 2040 in a chip socket assembly or in a chipfile assembly. In this manner, a chip socket assembly or chip fileassembly may be used to mount a chip 2040 directly over a bus of acircuit board without a separate conductive interconnect, such as anelastomeric connector sheet, and provide for a relatively low inductanceconnection between leads 2042 and the bus.

FIG. 23 shows leads 2042 in a compressed state, as exists when chip 2040is mounted over surface 2043. In the compressed state, leads 2042electrically and mechanically contact surface 2043. For one embodiment,surface 2043 is a metallic surface on a printed circuit board. Foranother embodiment, surface 2043 is an elastomeric connector.

Printed circuit boards can be installed in a chip file, according to oneembodiment of the present invention. FIG. 24 shows a side view ofprinted circuit card 2204 installed so as to be electrically coupled toelastomeric connector sheet 2206 and to metallic surface 2207 of aprinted circuit mother board 2210. Printed circuit board 2202 is securedby clip 2214. The entire assembly that includes clip 2214, printedcircuit board 2202, metallic connector 2204, elastomeric surface 2206,and printed circuit board 2210 is referred to as assembly 2200. Pads2212 and 2213 reside on printed circuit board 2202. Pads 2212 and 2213are connected to other circuitry on printed circuit board 2202. As shownin both FIG. 24 and FIG. 25, wrap-around connection 2204 is coupled topad 2212 and pad 2213. Wrap-around connection 2204 allows electricallyconnection between pads 2213 and 2212 with conductive surface 2207 onmother board 2210. Assembly 2200 allows printed circuit boards to beconnected together and secured with a relatively good connection.

For an alternative embodiment, no elastomeric sheet 2206 is used.Instead, wrap-around connection 2204 directly contacts conductivesurface 2207.

FIGS. 26 and 27 show a method for assembling a wrap around connectorwith the pads of printed circuit board. FIG. 26 shows metallic leadframe 2248 having arms 2250 through 2255. Arms 2250 through 2255 aresoldered to respective pads 2260 through 2265 of printed circuit board2202.

As shown in FIG. 27, portion 2280 is cut away from the rest of metallead frame 2248. This results in metal strips 2290 through 2295 beingattached to pads 2260 through 2265, but not being attached to metalpiece 2280.

Metal leads 2290 through 2295 are each then wrapped around the bottomprinted circuit board 2202 to be attached to the other side. For oneembodiment of the present invention, respective pads reside on the otherside of printed circuit board 22. Metal leads 2290 through 2295 are thensoldered to those metallic pads residing on the other side of printedcircuit board 2202. For an alternative embodiment of the presentinvention, a plastic housing resides on the other side of printedcircuit board 2202 and the ends of leads 2290 through 2295 are wrappedaround so that end of those leads reside within the plastic housing (notshown).

The result of the process shown in FIGS. 26 through 27 is, for oneembodiment of the invention, structure 2200 shown in FIG. 24.

FIG. 28 shows an embodiment of the invention wherein a chip file is usedfor general purpose function expansion in addition to memory expansion.FIG. 28 shows integrated circuit 2310 secured in a left socket (or base)2318 and a right socket (or base) 2316.

Leads 2332 of integrated circuit package 2310 are connected to the topof elastomeric connector sheet 2334. Elastomeric connector sheet 2334allows current to flow in a vertical direction and prevents the shortingtogether of leads 2332. Elastomeric connector 2334 allows current toflow into strips 2324 of printed circuit board 2330. For one embodimentof the present invention, strips 2324 carry bus signals for a computersystem. Printed circuit board 2330 carries other signals on variousother metallic strips to other circuitry.

For one embodiment of the invention, ribbon cable 2312 is connected toan integrated circuit residing inside of integrated circuit package2310. For one embodiment of invention, ribbon cable 2312 is comprised ofa number of metallic signal lines and carries non-bus signals. Forvarious embodiments, the non-bus signals carried by ribbon connector2312 include video signals, keyboard signals, disk drive signals, orother types of signals that differ from the bus signals carried byconnective strips 2324.

The integrated circuit package 2310 of FIG. 28 can be secured to leftsocket 2318 and right socket 2316 by clips or other techniques. For analternative embodiment of the present invention, the connection betweenleads 2332 and signal lines 2324 can be done directly without the use ofelastomeric connector sheet 2334. For that alternative embodiment, caremust be exercised that there are no shorts between the various leads, soeach of the strips 2324 needs to be relatively narrow.

For still other embodiments, a suitable edge-mountable chip having leadsor other suitable electrical connectors on the top edge of the chip, forexample, may be mounted over a bus of a circuit board using a chipsocket assembly or a chip file assembly. A separate bus formed, forexample, with conductive elastomer may then be coupled to the electricalconnectors on the top edge of the chip. For various embodiments, a clipsuch as clip 430 (see FIG. 4), 830 (see FIG. 8), and 1230 (see FIG. 12),for example, may be configured to mount the separate bus over the topedge of the chip. The underside of the bridge structure of the clip mayhave suitable pads, for example, for electrical connection to the topedge of the chip. A suitable conductive interconnect, such as anelastomeric connector sheet, for example, may be configured between thetop edge of the chip and the underside of the bridge structure to helpprovide for the electrical connection between the separate bus and thechip. For other embodiments, other suitable techniques may be used tocouple the separate bus to the chip.

The separate bus may be used, for example, to carry video signals,keyboard signals, disk drive signals, or other suitable signals betweenthe chip and any suitable component, such as a CRT, keyboard, or diskdrive, for example, operatively coupled to the separate bus. In thismanner, the chip socket assembly and the chip file assembly may be usedto provide for the addition, removal, or replacement of enhanced systemfunctionality in a relatively easy manner.

There can be better reliability if a metallic lead of an integratedcircuit wipes against another conductive surface during the insertion ofthat integrated circuit into a socket. FIGS. 29, 30, and 31 illustrateembodiments of the invention that permit a wiping action between a leadand a metallic surface the lead is to be connected to. The metallicsurface can be the top of a elastomeric connection sheet or the top of ametal bus of a motherboard, for example. In FIG. 29, a cam follower 2352is shown as being connected to an integrated circuit chip package 2350.The integrated circuit chip package has leads 2354 at its bottom. Theintegrated circuit 2350 has cam follower 2352 on each side of theintegrated circuit chip package for one embodiment of the presentinvention. For other embodiments, there is only one cam follower 2352 atone side of the integrated circuit chip package 2350.

For one embodiment of the invention, integrated circuit chip package2350 is positioned so that cam follower 2352 is inserted into slot 2362,which is also referred to as notch 2362 or passageway 2362. For the waythings are illustrated in FIGS. 29 and 30, integrated circuit 2350 wouldbe turned 180 degrees. For one embodiment of the invention, however,integrated circuit chip package would have another cam follower at theother sides, meaning that the integrated circuit 2350 would not need tobe turned.

Slot 2362 has a wider opening 2364 at the top, for one embodiment. Slot2362 has a wider opening 2366 at the end of slot 2362. Slot 2362 is partof chip file 2360 or socket 2360. In other words, structure 2360 can bea chip file or an individual socket. Slot 2362 is molded into socket2360. As shown in FIG. 30, slot 2362 has a relatively flat surfacetowards the end 2366. As cam follower 2362 travels through slot 2362,leads 2354 accordingly move downward and then in a horizontal directionas cam follower 2352 moves from opening 2364 to the end of 2366 of slot2362. The horizontal travel of cam follower 2352 causes leads 2354 tomove in a horizontal direction over the top of conductive elastomericconnector (not shown) that resides on top of a metallic strip or bus ona printed circuit board. A wiping action of leads 2354 as they movehorizontally along the top of the elastomeric connector results in acleaning action and a buffing action with respect to the leads and theelastomeric connection. This can result in a better electricalconnection between leads 2354 and the top of the elastomeric connection.This in turn can result in maximizing the reliability of the connectionbetween loads 2354 and the elastomeric connector (if one is present),and the metallic surface of printed circuit board.

Slot 2362 shown in FIG. 30 also holds integrated circuit 2352 in thechip file or socket. In other words, integrated circuit 2350 is securedby the placement of cam follower 2352 in the end portion 2366 of slot2362.

FIG. 31 shows another embodiment of the present invention that allows awiping motion of leads against either an elastomeric connection or themetallic surface itself of a printed circuit board. The embodiment shownin FIG. 31 includes a sliding beam 2380 that includes a vertical slot2362. For one embodiment, slider 2380 is made of plastic. For otherembodiments, other materials are used, including metal.

Slider 2380 resides on top of base 2382. Base 2382 is constructed ofplastic and includes slot 2388 that includes an end portion 2390. Endportion 2390 of FIG. 31 has a wider opening in relation to slot 2388 inorder to limit and secure the travel of a cam follower.

For the embodiment of FIG. 31, an integrated circuit ship (not shown)would have two cam followers—one residing near the bottom side of theintegrated circuit, as shown in FIG. 29, and an additional cam followerresiding farther up the side of the integrated circuit so that camfollower residing farther up the side of the integrated circuit wouldfit into socket 2364 of slider 2380. The lower cam follower of theintegrated circuit would fit into slot 2388 of the base unit 2382. Whenslider 2380 is moved to left or to the right, the integrated circuit ispushed to the left of the right because the cam follower residing inslot 2386 is moved to the left or to the right. This in mm makes thelower cam follower move to the left or the right in the bottom of slot2388, until the lower cam hits the end portion 2390.

As the cam follower moves through the final stages along slot 2388, thecam follower moves in a substantially horizontal direction. This causesthe lower leads of a vertical integrated circuit package to move in ahorizontal direction, which in turn causes the leads to wipe againsteither the elastomeric connection, if one is present, or the metallicsurface of the printed circuit board, if no elastomeric connector ispresent. In any event, there is a wiping action with respect to theleads during the horizontal travel period, which as discussed above,improves the reliability of the electrical connection between the leadsand either the elastomeric connector (if one is present), or themetallic surface of the printed circuit board.

According to one embodiment of the invention, base unit 2360 shown inFIG. 30 resides on both sides of the integrated circuit. For anotherembodiment, base unit 2360 with its slot 2362 resides only on the leftside or the right side of the base unit that secures the integratedcircuit package. The same applies to the embodiment shown in FIG. 31.For one embodiment, there is a slider 2380 and a base unit 2382 on oneside of the integrated circuit. For another embodiment, both sides ofthe base unit have slots similar to slots 2386 and 2388. Slots 2362 and2386 would be positioned such that the horizontal direction would be thesame if both sides of a chip file or base includes slots.

For one embodiment, slider 2380 and base 2382 are part of a chip filethat includes several vertical DRAMS. When slider 2380 is moved to theleft or to the right, all the DRAMS in the chip files that are insertedinto the slots move to the left or to the right. This means that all theleads of all the DRAMS experience a horizontal wiping action at once.This allows for better reliability and better connection for the DRAMSin all the chip files. This also facilitates manufacturing and assemblyof a DRAM chip file, given that slider 2380 allows all the DRAMS toexperience wiping at once.

FIGS. 32, 33, and 34 show an embodiment of the invention for connectionof a surface horizontal package (“SHP”). FIG. 32 shows assembly 2501that includes surface horizontal package 2500, frame 2540 (also referredto as socket 2540), and plastic securing member 2530.

Surface horizontal package 2500 includes substantially C-shaped leads2502 that reside on one side of the horizontal chip package 2500.Horizontal chip package 2500 also includes mechanical support pins 2510and 2511 at the left side of the horizontal package, and mechanicalsupport pins 2512 and 2513 at the right side of the end of horizontalpackage 2500. Horizontal package 2500 includes an integrated circuitmounted inside of a plastic package, wherein the leads of the integratedcircuit are connected to leads 2502 of package 2500.

Horizontal package 2500 also includes wedge 2520 that has a rampedsurface 2522 and a flat top surface 2524. Wedge 2520 is also referred toas ramp 2520. For one embodiment of the invention, wedge 2520 is on oneside of the chip package and another wedge is shown on the other side ofthe chip package (not shown). For an alternative embodiment of theinvention, there is only one wedge 2520 at one side of the horizontalchip package 2500. But for the embodiment shown in FIG. 32 there are twowedges, one of which is not shown.

Mechanical pins 2510, 2511, 2512, and 2513 are used to provide verticaland horizontal alignment when horizontal chip package is inserted intoframe 2540. Frame 2540 has square projections 2541 and 2543 that jutinto the interior of frame 2540. Mechanical pins 2510 through 2513 areinserted between portions 2541 and 2543 of frame 2540.

For one embodiment of the invention, frame 2540 is secured to the top ofa printed circuit board by using bolts 2542 and 2544.

For one embodiment, surface horizontal package 2500 contains a DRAM. Foran alternative embodiments, surface horizontal package 2500 contains aRambus™ DRAM or any other type of integrated circuit.

Base 2330 is also referred to as sliding member 2530. Sliding member2530 is constructed of plastic for one embodiment of the invention. Forother embodiments, other materials can be used. Sliding member 2530 canslide horizontally forward and backward above the printed circuit board.For one embodiment, sliding member 2530 moves along guide rail 2545. Forone embodiment there is a corresponding guiderail on the other side offrame 2540.

FIG. 33 shows a cross-sectional side view of sliding member 2530 andframe 2540. Sliding member 2530 and frame 2540. Sliding member 2530includes a wedge extension 2552 that includes a slope surface 2554 and aflat surface 2556. When horizontal package 2500 is inserted into frame2540, the wedge 2520 of package 2500 contacts wedge 2552. Given thatsurfaces 2522 and 2554 are ramps, wedges 2520 and 2552 move past eachother such that surfaces 2524 an 2556 soon contact each other and faceeach other. The sloped faces of wedges 2522 and 2554 causes chip package2500 to move downward within frame 2540. This action is caused bysliding member 2530 being moved in a direction towards the back of frame2540. As shown in FIG. 33, the movement of member 2530 is in a righthand direction.

As sliding surface 2522 moves along 2554 horizontal package 2500 movesin a downward direction. The result of this downward direction is shownin FIG. 34. FIG. 34 shows that faces 2556 and 2524 face each other. Theresult of this is that leads 2502 are compressed and make a goodelectrical contact with the top of elastomeric connector sheets 2532.Elastomeric connector sheet 2532 is connected to metallic surface 2534of a printed circuit board.

Thus, assembly 2501 allows a horizontal chip package 2500 to be securelystationed within a frame on a printed circuit board and have the leads2502 make good electrical contact with elastomeric connector 2532, whichin turn is connected to the metallic surface of the printed circuitboard. For an alternative embodiment of the invention, elastomericconnector 2532 is omitted and leads 2502 make direct contact withsurface 2534 of the printed circuit board. Metallic surface 2534 isconnected to other circuitry and other lines of the printed circuitboard, and also connected to other circuitry of a computer system, forexample.

It is to be appreciated that the assembly 2531 permits a wiping actionas the wedges 2520 and 2552 contact each other and as sliding member2530 moves in a direction towards frame 2540. Assembly 2501 also permitsa secure arrangement that aligns and holds horizontal chip package 2500within frame 2540. Mechanical pins 2510 and 2513 contact areas 2541 and2543 to provide alignment. Mechanical pins 2511 and 2512 contact frame2540. Alignment is thereby secured.

For other embodiments of the invention, other types of projections orsurfaces could be used in place of wedges 2520 and 2552.

For other embodiments of the invention, horizontal chip file 2500 hasdifferent types of leads 2502. For one embodiment, leads 2502 are notC-shaped, but are instead merely substantially horizontal leads that areslightly bent or merely horizontal.

For the embodiment shown in FIG. 32, however, C-shaped leads 2502 areflexible and compressible. For one embodiment, leads 2502 are made ofberyllium-copper.

FIGS. 35 and 36 show a clam shell type socket for securing a surfacehorizontal package (“SHP”) integrated circuit. For one embodiment of theinvention, the integrated circuit could be a Rambus™ DRAM or other typeof DRAM. For other embodiments, any other horizontal packaged integratedcircuit can be secured by socket 2600.

Socket or assembly 2600 includes a hinged clamp 2602 that rotates aboutaxis 2618. Elastomeric connector 2614 resides underneath hinged clamp2602. Hinged clamp 2602 is coupled via axis 2618 to frame 2606. Frame2606 includes a latch 2612 and filled-in corner portions 2608 and 2610.Filled-in corner portions 2608 and 2610 are used to help secure ahorizontal chip package that is placed within frame 2606.

Lever arm 2604 is connected to hinged clamp 2602. When lever arm 2604 ismoved downward, the hinged clamp 2602 also moves downward. Lever arm2604 is secured by latch 2612. For one embodiment of the invention,lever arm 2604, hinged clamp 2602, frame 2606, and latch 2612 are madeof plastic. For one embodiment, lever arm 2604 is made of flexibleplastic such that lever arm 2604 can be bent to be secured by latch2612. For another embodiment, latch 2612 is likewise made of flexibleplastic so that both lever arm 2604 and latch 2612 can flex in order tosecure lever arm 2604 within latch 2612.

FIG. 36 shows a side cut-away view of clam shell socket 2600. Ahorizontal chip package 2630 is secured by assembly 2600. For oneembodiment, chip 2630 is a surface horizontal package. Surfacehorizontal package 2630 includes electrical leads 2634. Horizontal chippackage 2630 also includes securing pins 2632 on the other side of thehorizontal chip package. Mechanical securing pins 2632 reside betweenfilled in corners 2608 and 2610 shown in FIG. 35.

Electrical leads 2634 are secured by hinged clamp 2602. Leads 2634, sosecured, are pushed down against the top of elastomeric connector sheet2614. Elastomeric 2614 is in turn pressing against a metallic surface ofa printed circuit board. The printed circuit board is the printedcircuit board that frame 2606 is secured to.

Thus, the clam shell socket 2600 is a way for holding and securing ahorizontal chip package. The chip package stays secured as long as leverarm 2604 resides within latch 2612. The chip package can be removed fromassembly 2600 by releasing the lever arm from latch 2612. Filled-incorners 2608 and 2610 contact mechanical pins 2632, allowing horizontalchip package 2630 to be properly aligned within frame 2606. The ends ofmechanical alignment pins 2632 contact against the end of plastic frame2602 providing another alignment mechanism to keep horizontal chippackage aligned within frame 2606.

For an alternative embodiment of the invention, horizontal chip package2630 can have leads at both ends, which means that an elastomeric sheetwould be used at both ends of frame 2606.

FIG. 37 illustrates another way to secure a surface horizontal package(“SHP”) 2702 to a printed circuit board. Horizontal chip package 2702includes mechanical alignment pins 2704 and electrical leads 2706.Horizontal package 2702 is secured by means of a clip 2700 that issecured by a locking tab 2712 that is connected to a base, which in turnis connected to a printed circuit board. Clip 2700 includes a beamportion 2714 that is horizontal and that juts out over the top ofhorizontal chip package 2702. Clip 2700 also includes a downward member2710 that presses against the top of leads 2706. Leads 2706 are therebypressed securely on top of elastomeric connector 2708. Elastomericconnector 2708 is in turn connected to a metallic surface of a printedcircuit board.

For one embodiment of the invention, clip 2700 is a one piece plasticclip that is removable. A horizontal chip package 2702 can be removedfrom its secure installation by pushing beam 2714 upward. Likewise,horizontal chip package is secured by placing the horizontal chippackage 2702 under clip 2700 and pushing beam 2714 downward to the pointwhere the position shown in FIG. 37 is achieved.

For an alternative embodiment, clip 2714 can be attached to chip 2702 orintegrally molded to chip package 2702. For one embodiment, clip 2700 ismade of thermally enhanced plastic to allow heat dissipation. Foranother embodiment, clip 2700 is an integrated heat sink for chip 2702.For that embodiment, clip 2700 is constructed of metal in order todissipate heat.

FIG. 38 shows another way of securing a horizontal chip package 2734.For the embodiment shown in FIG. 38, a tab 2720 secures a clip 2722,that in turn resides on top of horizontal chip package 2734. Tab 2720includes a notch 2738 under which clip 2722 resides.

For one embodiment of the invention, clip 2722 is substantially planarand constructed of plastic. For another embodiment, clip 2722 isintegrally molded to chip 2734 and made of plastic.

For another embodiment, clip 2722 is made of metal to allow heatdissipation. For yet another embodiment, clip 2722 is constructed ofthermally enhanced plastic.

When clip 2722 resides under notch 2738 of tab 2724, horizontal chippackage 2734 has its leads 2740 pressed against and compressed withrespect to elastomeric connector 2736. This allows a relatively goodelectrical connection between leads 2724 and elastomeric connector 2736.Elastomeric connector 2736 is in turn connected to the metallic surfaceof a printed circuit board.

Horizontal chip package is removed by moving clip 2722 to the right sothat no portion of clip 2722 resides underneath the notch of tab 2720.When clip 2722 is released, this in turn releases horizontal chippackage 2734.

In order to secure chip 2734, clip 2722 is placed on top of 2734 andclip 2722 is secured underneath tab 2720 by having clip 2722 residewithin notch 2738. Again, this secures horizontal chip package 2734 andallows for a relatively good electrical connection.

In the foregoing description, the invention has been described withreference to specific exemplary embodiments thereof. It will, however,be evident that various modifications and changes may be made theretowithout departing from the broader spirit or scope of the presentinvention. The specification and drawings are, accordingly, to beregarded in an illustrative rather than a restrictive sense.

What is claimed is:
 1. An assembly comprising: a base having a bottom,and a first slot for receiving a chip package and for guiding the chippackage to the bottom of the base and a second slot for guiding asupport pin of the chip package when the chip package is placed in theslot of the base; a clip configured to mate with the base for retainingthe chip package in the base; and a chip package secured in the base,wherein the chip package has a lead electrically coupled to the bus;wherein the lead is substantially C-shaped.
 2. The assembly of claim 1,further comprising a flexible insert, wherein the substantially C-shapedlead is wrapped around the flexible insert.
 3. The assembly of claim 2,wherein the flexible insert is a compliant cylinder.
 4. An assemblycomprising: a base having a bottom, and a first slot for receiving achip package and for guiding the chip package to the bottom of the baseand a second slot for guiding a support pin of the chip package when thechip package is placed in the slot of the base; a clip configured tomate with the base for retaining the chip package in the base; a circuitboard secured to the base, wherein the circuit board includes a bus; achip package secured in the base, wherein the chip package has a leadelectrically coupled to the bus; a conductive interconnect disposedbetween the lead and the bus; wherein the conductive interconnect is anelastomer connector sheet.